• Single-Sided Rigid Boards
• Double-Sided Rigid Boards with or without plated-through-holes
• Multilayers up to 12 layers with normal as well as blind and/or buried vias
• Single and Double-Sided Flexible Circuits
• Multilayer RF/Microwave Boards

SUBSTRATES

• Standard Epoxy Glass NEMA grade FR4
• Exotic Materials with higher maximum operating temperatures, lower co-efficients of expansion and/or higher Tg levels.
• RF/Microwave Materials including Teflon (Polytetrafluoroethylene-PTFE) and Duroid (Glass Reinforced PTFE Composite), with capabilities of etching surface for improved bonding of through-hole plating and solder mask coating.

BOARD FINISHES

• Alpha SILVER
• Hot Air Levelled
• Solder Mask Over Bare Copper (SMOBC)
• Gold Plated

BOARD OPTIONS

• Gold on Nickel Contact Fingers
• CNC Routing
• Scoring (V grooving)
• Panel Routing
• Screenprinted Component Legends
• Liquid Photoimageable Solder Mask Inks (LPSM)
• Dry Film Solder Mask (DFSM)
• Peelable Solder masks (for temporary protection from solder during wave soldering)
• Screenprinted Conductive Inks (Carbon)
• Bare Board Testing including Surface Mount Pads

Contact us if your special requirements are not listed here. We are interested in meeting your needs and will do so if at all possible. Please ask!