The purpose of this document is to establish design rules, principles and other considerations for mechanical, electrical and manufacturable properties which the designer can use to select design features, and properties that will result in a board that will meet producibility, performance and cost requirements. Other documents which elaborate further on some of those design rules are available.

It must be stated however that Precision has capabilities to tackle more stringent tolerances and would welcome the opportunity to discuss your special needs.

External Layers and Internal Signal Layers A - Hole to Pad B - Track to Hole Edge (non-plated hole) C - Track Width D - Track to Track Spacing E - Track to Pad Spacing F - Pad to Pad Spacing G¹ - Track to Board Edge (routed) G * - Track to Board Edge (scored) H - Hole Edge to Board Edge (routed) H - Hole Edge to Board Edge (scored) I - Hole Size min 0.25mm min 0.30mm min 0.12mm min 0.12mm min 0.12mm min 0.20mm min 0.30mm min 0.60mm min 0.40mm min 0.70mm min 0.30mm ¹ see CID-017 for further details * see CID-016 for further details

Internal Power and Ground Planes I - Hole to Pad J - Connection Track (thermal relief) K - Plane to Hole Edge (plated) K - Plane to Hole Edge (non-plated) L - Plane to Pad M - Plane to Board Edge (routed) M - Plane to Board Edge (scored) min 0.25mm min 0.20mm min 0.40mm min 0.30mm min 0.20mm min 0.30mm min 0.50mm

Legend N - Legend to Hole O - Legend to Pad (surface mount) P - Line/Text width min 0.10mm min 0.20mm min 0.15mm

Solder Mask Q - Mask to track R - Mask to Pad S - Mask Wall (lpsm) S - Mask Wall (dfsm) T - Mask to Board Edge (routed) T - Mask to Board Edge (scored) min 0.10mm min 0.10mm min 0.10mm min 0.15mm min 0.15mm min 0.40mm