| TRACK TO BROAD EDGE DESIGN GUIDLINES | |||||
The purpose of this document is to clarify the issues relating to clearance needs from track to board edge.
1) To avoid partial or complete removal of tracks. Apart from the obvious problem associated from such an occurrence, partial removal will result in exposed copper on the edge of the board causing : 2) To enable complete encapsulation of the tracks with solder mask which also improves the adhesion of the mask on the edge of the board. Edge Clearance Requirements Even with 0.3mm clearance, track edge exposure is still possible, if all of the allowable variables are on maximum and in opposite directions. These variables include machining under nominal by 0.2mm and pattern location movement of 0.1mm.
In cases other than 1.6mm thickness, use the following formula to calculate the clearance required on top of the 0.30mm specified above: additional clearance = Tan (15 o ) X depth of cut Please Contact our Customer Support Department, if any further clarification is required. |
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