Carbon filled Polymer Thick Film (PTF) paste is now widely used on Printed Circuit Boards for use as an alternative to electroplated nickel/gold contacts. The paste once cured is highly conductive and provides a corrosion resistance comparable to gold and a hard durable surface which is able to withstand many insertions or contacts and fluxes used during soldering operations. The resistance of the cured carbon is approximately 40 W/cm 2 over full contacts at parallel edges at 30mm coating thickness.
The purpose of this document is to clarify design requirement relating to the use of carbon contacts.
