2. Plating In Holes

Copper voids	- none allowed.
Burrs, nodules & protrusions	- allowed if min.   hole diameter is met.
Final coating voids	- 1 void not exceeding   1% of hole well area.

3. Plating Thicknesses

Copper	- 25 um min. ave. with 20 um min.
Nickel	- 5 um min.
Gold	- 1¹ um min.

4. Solder Mask
Mask on pad is allowed so long as it leaves a minimum solderable annular ring of 0.05mm.

The mask should be bonded to the board surfaces with no visible skipping or void. The conductive patterns should be completely covered.

5. Component Legend
Legend should be legible and positioned within 0.25mm of absolute nominal.

6. Workmanship
Boards should show no visual evidence of dirt, foreign matter, oil, fingerprints, flux residue, and other contaminants that affect life, ability to assemble and servicing.

7. Annular Ring
The minimum annular ring for plated holes should be no less than 0.05mm except at the conductor junction where is should be no less than 80% of track width.

8. Track Width
Any combination of edge roughness, nicks, dents, pinholes and overetching should not reduce the track width by more than 20%.

9. Track Spacing
Any combination of edge roughness, copper spikes and spurious copper should not reduce spacing by more than 20%.

10. Solderability
Boards should show 95% wettability of surface and all holes should show evidence of wetting when wave soldered with mildly activated fluxes.

11. Mechanical Requirements

Board Thickness

Thickness (mm)	Tolerance (mm)
0.5 0.8 1.6 2.4 3.2	+ 0.05 + 0.10 + 0.13 + 0.18 + 0.23

Hole Sizes
+ 0.1/- 0.05 mm of sizes given.

Board Size
+ 0.25mm of dimensions given or + 0.4mm of corner marks.

Hole to Hole
+ 0.1mm of dimensions given or artwork positions.

Flatness
1% of the diagonal across the two opposite corners.